SAN JOSE, Calif., Sept. 20, 2013 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a leading provider and innovator of optical communications solutions, today announced the company's participation at ECOC, Europe's largest optical networking conference, and the continuing expansion of their 100G product offerings for both datacom and telecom implementations. Oclaro will be hosting customer meetings and highlighting its client and line-side product portfolio during ECOC in Room MR3 at the ExCEL exhibition hall in London, UK from September 23-25, 2013.
Featured products designed for line-side applications, and based on indium phosphide technology, include highly-integrated components that enable next generation coherent pluggable transceivers for 100G and 200G applications in both the CFP and CFP2 form factors. Oclaro has recently started sampling its components to select customers for system level testing, and results show that the performance meets the requirements of both metro and regional DWDM networks. Some of the recent progress will also be discussed in the technical and Market Focus presentations listed below.
Oclaro also separately announced the following product news:
Volume production of the client-side, dual-rate 100G LR4 CFP2
Sampling of its 10G SFP+ 2-km reach transceiver for wireless backhaul applications
Availability of the 10G DWDM Tunable SFP+ transceiver
Volume production of its narrow linewidth micro-iTLA
An advanced Raman and Hybrid-EDF amplification solution for next generation networks
Oclaro presentations include:
Indium Phosphide Enabled 100G/200G Coherent
Market Focus Theatre presentation - Next Generation High Bit Rate Coherent Interfaces, Wednesday, September 25, 12:15 - 12:45
Andy Carter, chief scientist and optical technology expert at Oclaro will speak about the role of indium phosphide-based components to achieve next generation small form factor and pluggable coherent transceiver designs.
Technical Conference Presentation - Mo.3.C.2: Progress in Indium Phosphide-based Photonic Components and Subsystems for Digital Coherent Systems at 100Gbit/s and above, Room C, Monday, September 23, 14:30
Wladek Forsiak, technology and systems director at Oclaro will present an invited paper that will focus on progress in InP-based photonic components and subsystems that enable cost-effective, compact and scalable new transceiver solutions for 100G and beyond.
Technical Conference presentation - Th.1.B.3: Narrow Linewidth, High Power, High Operating Temperature Digital Supermode Distributed Bragg Reflector Laser, Room B, Thursday, September 26, 9:30
Sam Davies, senior R&D engineer for Oclaro, will discuss the use of monolithic InP-based lasers for high production volumes to support metro/regional and long-haul systems and future laser-modulator integration which will further reduce the cost and size of coherent transmitter solutions.
10G DWDM Tunable SFP+
Poster presentation - Monolithic Integration of AlInGaAs DS-DBR Tunable Laser and AlInGaAs MZ Modulator with Small Footprint, Low Power Dissipation and Long-Haul 10Gb/s Performance. Tuesday, September 24, 16:00-17:30
Andrew Ward, principal engineer and scientist from Oclaro Caswell, UK, will focus on tunable pluggable transceiver modules that meet the requirements for full tunability together with transmission performance to support metro/regional and long-haul DWDM systems while delivering on a dramatically lower size and power dissipation as compared to 300-pin transponders.
Market Focus Theatre presentation - Advanced amplification technologies for optical mesh networking, Tuesday, September 24, 13:50 - 14:20
Per Hansen, vice president for Optical Network Solutions at Oclaro, will provide an overview on future meshed network amplification requirements that have spawned advances in amplifier designs, uncooled multi-chip pumps, amplifier components and features for operational simplicity including "intelligent" hybrid Raman-EDFAs.
ECOC Workshop - VSR Interconnect Workshop: Technologies for Short Reach Optical Interconnects
Room D, Sunday, September 22, 14:00
Kiyo Hiramoto, product marketing manager with the Oclaro Japan modular device business unit, will highlight Lens-integrated Surface-emitting DFB Laser (LISEL) arrays operating at 25-40 Gbit/s per channel. LISEL technology is predicted to be an alternative for VCSEL in the future development of 40G and 100G client-side, ultra-small transceiver technology and beyond for optical backplane and interconnects that support data center applications.
Oclaro, Inc. (NASDAQ: OCLR) is one of the largest providers of optical components, modules and subsystems for the optical communications market. The company is a global leader dedicated to photonics innovation, with cutting-edge research and development (R&D) and chip fabrication facilities in the U.S., U.K., Italy, Korea and Japan. It has in-house and contract manufacturing sites in China, Malaysia and Thailand, with design, sales and service organizations in most of the major regions around the world. For more information, visit http://www.oclaro.com.
Copyright 2013. All rights reserved. Oclaro, the Oclaro logo, and certain other Oclaro trademarks and logos are trademarks and/or registered trademarks of Oclaro, Inc. or its subsidiaries in the US and other countries. All other trademarks are the property of their respective owners. Information in this release is subject to change without notice.
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