Oclaro

Press Releases

Sep 19, 2018
Oclaro to Showcase Expansive Portfolio of High-Speed Lasers for Access and Wireless Networks at ECOC 2018
Company Further Expands Production Capacity to Meet Growing Customer Demand for a New Generation of 5G-Ready Wide Temperature and High-Performance Lasers

SAN JOSE, Calif., Sept. 19, 2018 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a leading provider and innovator of optical communications solutions, today announced availability of its full suite of high-speed lasers for access and wireless networks. Designed to meet the high-performance and rigorous environmental conditions of access deployments, these lasers include a 25 Gbps uncooled Industrial-temperature (I-temp) rated Direct Modulated DFB laser (DML) chip, 10 Gbps high-power I-temp DML laser chip and new electro-absorption modulated (EML) lasers that also service data center applications. To meet growing customer demand for these lasers and in anticipation of the future ramp of 5G optical links, Oclaro has recently expanded its production capacity by investing in new wafer fab equipment in its Japan and UK production facilities.

"Network upgrades to the current access infrastructure will require a new generation of low-cost, robust, and high-speed lasers that can withstand the rigorous requirements demanded by deployments in outdoor enclosures and uncontrolled temperature nodes," said Walter Jankovic, President of Oclaro's Optical Connectivity Business Unit. "Oclaro has designed its lasers specifically to deliver a higher level of performance over wide operating temperature ranges and support critical features such as PAM4 modulation. These lasers are expected to be critical components to support the introduction of 5G wireless networks by enabling customers to upgrade their wireless fronthaul links from 10 Gbps to 25 Gbps to 50 Gbps."

Oclaro will be available to meet with customers and discuss these products at next week's ECOC Exhibition in Rome, Italy in Oclaro meeting rooms # SC2-B & SC2-C.

About the Lasers

  • The 25 Gbps uncooled DML chip is capable of operating at high temperature up to 95C. By using this laser, transceiver suppliers will not have to mount an expensive, power-hungry thermoelectric cooler inside the SFP28 I-temp. In addition, the high bandwidth of the Oclaro DML chip enables 50 Gbps PAM4 waveforms to be obtained with 5 dB Extinction Ratio and TDECQ values of less than 2.0dB. These features enable the laser to operate in 50GbE transceivers such as SFP56 or QSFP28.
  • The 10 Gbps high-power I-temp DML laser chip is designed for carriers currently upgrading the data rate to 10 Gbps as per the new XGS-PON/10GE-PON standards. By enhancing its DML waveguide design, Oclaro has been able to deliver a 10 Gbps high-power 1270nm DML chip for ONU equipment for XGS-PON/10GE-PON. Key differentiators of this laser chip are its high optical output power (15mW at 95C) and high bandwidth (more than 15GHz).
  • Oclaro's EML designs are capable of high-speed operation for 100 Gbps PAM4 using an extremely high-bandwidth modulator. Oclaro EMLs have passed the rigorous damp heat operating and storage requirements of GR-468, making them an attractive option for coolerless operation over typical data center temperature ranges. These lasers do not require hermetic packaging, saving cost over other lasers requiring hermetic TOSA designs. Oclaro is also developing new 10Gbps EMLs for downstream PON applications and will be working with access market architects and transceiver manufacturers to bring these products to market.

Availability

Oclaro's 25 Gbps uncooled DML chip I-temp, 10 Gbps high power DML LD chip I-temp, and EMLs are all currently in mass production.

About Oclaro

Oclaro, Inc. (NASDAQ: OCLR), is a leader in optical components and modules for the long-haul, metro and data center markets. Leveraging more than three decades of innovation in laser technology and photonics integration, Oclaro provides differentiated solutions for optical networks and high-speed interconnects driving the next wave of streaming video, cloud computing, application virtualization, and other bandwidth-intensive applications. For more information, visit www.oclaro.com or follow on Twitter at @OclaroInc.

Copyright 2018. All rights reserved. Oclaro, the Oclaro logo, and certain other Oclaro trademarks and logos are trademarks and/or registered trademarks of Oclaro, Inc. or its subsidiaries in the US and other countries. All other trademarks are the property of their respective owners. Information in this release is subject to change without notice.

Media Contact Info:
Kelly Karr
Tanis Communications, Inc.
408-718-9350
kelly.karr@taniscomm.com

Oclaro, Inc. Logo. (PRNewsFoto/Oclaro, Inc.) (PRNewsfoto/Oclaro, Inc.)

 

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SOURCE Oclaro, Inc.