"Network upgrades to the current access infrastructure will require a new generation of low-cost, robust, and high-speed lasers that can withstand the rigorous requirements demanded by deployments in outdoor enclosures and uncontrolled temperature nodes," said
About the Lasers
- The 25 Gbps uncooled DML chip is capable of operating at high temperature up to 95C. By using this laser, transceiver suppliers will not have to mount an expensive, power-hungry thermoelectric cooler inside the SFP28 I-temp. In addition, the high bandwidth of the Oclaro DML chip enables 50 Gbps PAM4 waveforms to be obtained with 5 dB Extinction Ratio and TDECQ values of less than 2.0dB. These features enable the laser to operate in 50GbE transceivers such as SFP56 or QSFP28.
- The 10 Gbps high-power I-temp DML laser chip is designed for carriers currently upgrading the data rate to 10 Gbps as per the new XGS-PON/10GE-PON standards. By enhancing its DML waveguide design,
Oclarohas been able to deliver a 10 Gbps high-power 1270nm DML chip for ONU equipment for XGS-PON/10GE-PON. Key differentiators of this laser chip are its high optical output power (15mW at 95C) and high bandwidth (more than 15GHz). Oclaro'sEML designs are capable of high-speed operation for 100 Gbps PAM4 using an extremely high-bandwidth modulator. Oclaro EMLs have passed the rigorous damp heat operating and storage requirements of GR-468, making them an attractive option for coolerless operation over typical data center temperature ranges. These lasers do not require hermetic packaging, saving cost over other lasers requiring hermetic TOSA designs. Oclarois also developing new 10Gbps EMLs for downstream PON applications and will be working with access market architects and transceiver manufacturers to bring these products to market.
Copyright 2018. All rights reserved. Oclaro, the Oclaro logo, and certain other Oclaro trademarks and logos are trademarks and/or registered trademarks of Oclaro, Inc. or its subsidiaries in the US and other countries. All other trademarks are the property of their respective owners. Information in this release is subject to change without notice.
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